Articles
IMEC UPW System Utilizes Liqui-Cel® Membrane Contactors For Oxygen Removal
January 30, 2005
IMEC's technology choices for process manufacturing steps used for project and process development reflect their commitment to using the best solutions available to them.
Projects are currently underway at IMEC to address major technological challenges for CMOS chips of the 100 and 65 nanometer generation. The center has three full-scale pilot manufacturing lines and 4800 M2 (51,666 ft2) of clean room facilities.
As future devices become smaller and as line widths become more critical, so too do the technologies required to produce high purity water for the process manufacturing steps in various microelectronics industries. Oxygen levels in the high purity water directly impact the product yields. New roadmaps for 300mm wafers and other small devices point to requirements of <1 ppb of dissolved oxygen.
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