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RSSImproved Semiconductor Wafer Cleaning By Using Dissolved Gas Control With Megasonics And Reducing Chemical Usage
March 12, 2009
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•Technical Brief: Improved Semiconductor Wafer Cleaning By Using Dissolved Gas Control With Megasonics And Reducing Chemical Usage
•Technical Brief: Improved Semiconductor Wafer Cleaning By Using Dissolved Gas Control With Megasonics And Reducing Chemical Usage
•Technical Brief: Improved Semiconductor Wafer Cleaning By Using Dissolved Gas Control With Megasonics And Reducing Chemical Usage
By Membrana
New processes for wet cleaning semiconductor surfaces have recently been developed. The new cleaning processes are designed to be more environmentally friendly and reduce the volume of chemicals used.
One such process(1) has been developed in Japan by Professor Ohmi and his researchers at Tohoku University. This cleaning process uses dissolved gasses and megasonic irradiation to remove particles, metals and organics from the surface of semiconductors.
Click Here To Download:•Technical Brief: Improved Semiconductor Wafer Cleaning By Using Dissolved Gas Control With Megasonics And Reducing Chemical Usage
