Find Out What's New At PACK EXPO International 2014

Whether they are contending with changing regulatory environments or striving to meet customer demands for greater sustainability measures, the ways beverage manufacturers address today’s challenges will impact future success.

This fall, PACK EXPO International 2014 (November 2-5; McCormick Place, Chicago), North America’s largest processing and packaging event, will serve as a hub for the innovation beverage manufacturers need. And, bolstered by the debut of the co-located Pharma EXPO, PACK EXPO will offer unique opportunities for new ideas and innovations to cross between industries.

PACK EXPO is owned and produced by PMMI, The Association for Packaging and Processing Technologies.

To help beverage brand owners, processors, and manufacturers more easily navigate the 1.15 million net square feet of exhibit space and locate the solutions and suppliers they need, PACK EXPO International includes industry-specific pavilions and features such as The Beverage Cooler Lounge, located on the Grand Concourse near the entry to the North Hall. Endorsed by the International Society of Beverage Technologists, The Beverage Cooler Lounge is a networking and information center where beverage manufacturers can network with industry peers and meet with suppliers.

Regardless of the market segments you serve, you’ll find plenty to help you reach your business goals:

• The Brand Zone (Upper North Hall) will help brand owners break the mold, with innovative containers and materials to interrupt the retail landscape, broaden your appeal, enhance your shelf presence and extend shelf life. The 11th Annual Showcase of Packaging Innovations™, sponsored by the Dow Chemical Company, will display an inspiring array of award-winning package designs from all over the world.
• The Processing Zone (Upper Lakeside) is a hub spotlighting the latest in processing technology. But PACK EXPO is about encountering innovation across your entire supply chain and you’ll find suppliers who can help you develop total systems solutions throughout the exhibit halls. The Reusable Packaging Pavilion (Upper Lakeside) will offer ways for you to explore methods of reducing waste, slashing shipping costs, protecting your goods, and increasing productivity and your bottom line. Whether you are looking to newly invest in reusable packaging or get more out of assets you already own, this pavilion is an excellent place to start.
• There will be an abundance of free educational opportunities at PACK EXPO International. Seminars on breakthrough technologies and techniques with applications in a wide variety of industries will be featured at three Innovation Stage locations throughout PACK EXPO alone. The Food Safety Summit Resource Center (Booth # S-2962), organized and owned by Food Safety Summit and co-sponsored by GE Intelligent Platforms, will present subject matter experts on critical food safety matters like the Global Food Safety Initiative (GFSI) and compliance with the Food Safety Modernization Act (FSMA). At the Center for Trends & Technology (CTT) (Booth # S-3907) you can learn about the absolute latest technologies and emerging trends on topics such as machine safety, the Internet of Things, serialization and line optimization.

Here is a sneak peek of just some of the innovations you can expect to see at the show:

• Turn-Key Solid State Relays & Contractors for Electrical Load Switching
  The new RGC2 and RGC3 series of three-phase switching solid state relays and contactors from Carlo Gavazzi (Booth #N-4365) will offer customers reliability for operations with varying line speeds. The relays and contactors are compact, turn-key and adept to scenarios requiring retrofitting. The RCG series components are easy to install and feature flexible configuration setups to fit the customers’ line needs.
• Cutting-edge Accuracy
  APACKS will launch its ExactMass liquid filling machine for the food and beverage, cosmetics and pharmaceutical industries. Customizable to suit each product’s viscosity and volume, it fills accurately and adjusts to weight using a cutting-edge coriolis meter. The meter measures mass and volume flow along with temperature and density all at once to product enhanced accuracy. The machine will be on display and in action for first time at PACK EXPO, Booth #N- 5339.
• Print Controllers Make Processing and Printing Variable Data Easy
  The AllMark 400 print controllers from ImTech (Booth #E-6747) feature an easy-to-use touchscreen interface for simple message creation and print all popular bar code symbol markups, including linear and 2-D. The controllers can also network with other devices, such as scales and bar code scanners, allowing for easy processing and printing of variable data.
• Advanced Automation Control in Tight Spaces
  At this year’s PACK EXPO, Branson Ultrasonics (Booth #N-6129) will showcase its lineup of new DCX compact ultrasonic welding power supplies. With its high degree of operational control and high-speed efficiency, the DCX lineup is optimal for tight spaces on the floor. The company also touts the lineup’s consistent weld quality, increased flexibility and advanced communication capabilities.

To register for PACK EXPO International 2014, visit packexpointernational.com. A discounted registration rate of $30 applies until Oct. 3, when it increases to $60.